BGA Rework Stations & Equipment

BGA Rework Stations & Equipment
Ball Grid Array (BGA) rework requires specialized equipment designed for precision component removal and reattachment. Our BGA rework collection features professional-grade stations engineered for electronics repair, PCB assembly, and semiconductor work.
BGA rework stations provide controlled heating profiles essential for safely removing and reballing integrated circuits without damaging the PCB substrate or surrounding components. These systems utilize infrared or hot air technology with precise temperature control, typically ranging from 100°C to 500°C, ensuring proper solder reflow for various lead-free and leaded solder alloys.
Key applications include motherboard repair, graphics card refurbishment, mobile device logic board repair, and industrial electronics servicing. Professional BGA rework equipment features optical alignment systems, programmable temperature curves, and split vision capabilities for accurate component placement.
Whether performing chip-off data recovery, GPU reballing, or production-level PCB assembly, proper BGA rework equipment ensures consistent results while minimizing thermal stress on sensitive components. Our selection supports both small-scale repair operations and high-volume manufacturing environments.